On Auguest 28th, Didier DESPLANCHE, president of ECAM LaSalle Engineering School in France, visited  CUIT. The two sides held in-depth discussions on deepening international education cooperation and promoting joint talent cultivation. A memorandum of understanding was signed during the visit. Secretary of Party Committee Shen Huoming and Vice President Wu Xi attended the meeting, which was chaired by Yang Zhipeng, Director of the International Exchange and Cooperation Office (School of International Education).

Shen Huoming extended a warm welcome to President DESPLANCHE and highlighted the shared vision between the two universities in talent cultivation and disciplinary development. He expressed confidence in future collaboration in global engineer training and expanding academic platforms.

President Didier DESPLANCHE introduced ECAM LaSalle’s features and strengths in interdisciplinary education and industry-academia partnerships and proposed deeper cooperation in IT and smart manufacturing.

Vice President Wu Xi outlined CUIT’s academic history and internationalization strategy, emphasizing plans for joint research platforms and faculty-student exchanges. After that, Zhang Gexiang, Dean of the School of Automation, Zhu Ye, Vice Dean of the School of Computer Science, and Zhang Fugui, Dean of the College of Electronic Engineering, respectively presented discipline-specific achievements and collaboration cases.

Didier DESPLANCHE and Shen Huoming jointly signed the Memorandum of Understanding, which outlines the framework and implementation plan for collaboration between the two sides in many areas.